| PART |
Description |
Maker |
| MPC2105A MPC2106ASG66 MPC2105B |
(MPC2105x / MPC2106x) 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms 128K X 72 CACHE TAG SRAM MODULE, 9 ns, DMA178
512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms 512KBMB的二级缓存模块BurstRAM为PowerPC制备/ CH旺平
|
Motorola, Inc.
Motorola Mobility Holdings, Inc.
|
| MPC2105C MPC2106CDG66 |
(MPC2105C / MPC2106C) 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms 128K X 72 CACHE SRAM MODULE, 9 ns, PDMA178
|
Motorola, Inc.
Motorola Mobility Holdings, Inc.
|
| DEVKIT-M24LR-A |
Development kit for M24LRxx-R
Development kit for M24LRxx Dual Interface EEPROMs
|
ST Microelectronics
STMicroelectronics
|
| AMSN2600DUT4C |
Processor Model 10 Multiprocessor Platforms
|
Advanced Micro Devices
|
| ISL95852 |
Integrated Power Management IC for IMVP8?Platforms
|
Renesas Electronics Corporation
|
| W254B |
133MHz Spread Spectrum FTG for Mobile Pentium? III Platforms
|
SpectraLinear Inc
|
| SKY65206-13 |
WLAN 802.11b/g Intera?/a> Front-End Module
WLAN 802.11b/g Intera⑩ Front-End Module
|
Skyworks Solutions Inc.
|
| ADM1023ARQ-REEL ADM1023ARQ-REEL7 ADM1023ARQZ |
±1°C Remote Sensor for Next Generation PIII 700 MHz Platforms
|
Analog Devices
|
| W254B |
133-MHz Spread Spectrum FTG for Mobile Pentium? III Platforms
|
Cypress Semiconductor
|
| ADM1029 |
Dual PWM Fan Controller and Temperature Monitor for High Reliability Platforms
|
Analog Devices
|
